Ephraim Suhir

• Advances in Electronic Packaging (AMD)
• Advances in electronic packaging, 1997
• Applied probability for engineers and scientists
• Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
• Mechanical Behavior of Materials and Structures in Microelectronics
• Micro- and opto-electronic materials and structures
• Micro- and Opto-Electronic Materials and Structures : Physics, Mechanics, Design, Reliability, Packaging
• Reliability of photonics materials and structures
• Structural Analysis in Microelectronic And Fiber Optic Systems
• Structural Analysis in Microelectronics and Fiber Optics (MD)
• Structural analysis in microelectronics and fiber optics, 1994
• Structural dynamics of electronic and photonic systems