Thermal and Electromigration Induced Strain and Microstructure Evolution in Metal Conductor Lines

Thermal and Electromigration Induced Strain and Microstructure Evolution in Metal Conductor Lines

115 pages· 2009· ISBN 9781109166958
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Thermal strains in Al and Cu conductor lines were found to show similar behavior. Rather than forming biaxial strains after heating, compressive strains formed along the line, and tensile strains formed in the other two directions, which was explained by an anisotropic partial relaxation model.

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